MRS1504T3G, NRVS1504T3G
http://onsemi.com
5
PACKAGE DIMENSIONS
SMB
CASE 403A?03
ISSUE J
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
b
D
c
L1
L
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.95 2.30 2.47 0.077
INCHES
A1
0.05 0.10 0.20 0.002
b
1.96 2.03 2.20 0.077
c
0.15 0.23 0.31 0.006
DD
3.30 3.56 3.95 0.130
E
4.06 4.32 4.60 0.160
L
0.76 1.02 1.60 0.030
0.091 0.097
0.004 0.008
0.080 0.087
0.009 0.012
0.140 0.156
0.170 0.181
0.040 0.063
NOM MAX
5.21 5.44 5.60 0.205
0.214 0.220
HE
0.51 REF
0.020 REF
L1
HE
POLARITY INDICATOROPTIONAL AS NEEDED
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MRS1504T3/D
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